BST

Decoupling Capacitors
Shown is a BST capacitor chip made on a silicon wafer used in a hearing aid module. It integrates 18 decoupling capacitors onto a single chip measuring 3mm x 5mm. The capacitors range in value from 440pF to 150nF. An integrated routing layer provides the circuitry used to interconnect certain elements of the capacitor array and to form I/O pads.


The high capacitance density that BST offers results in very small electrode sizes which minimizes series inductance, resulting in a comparatively high self-resonant frequency. The small electrodes also reduce the series resistance enabling high quality decoupling well into the GHz range.

By flip chipping an IC(s) directly onto the capacitor chip parasitics can be minimized further enhancing system performance.



Technical/Design guidelines

Parameter	Value
Minimum Size:	4 µm x 4 µm
Capacitance Density (per layer):	up to 64 fF/µm
Number of stacked layers:	1 to 6
Typical Leakage Current Density:	36 nA/sq. cm (@ 3V)

Gennum can assist in the design, simulation (circuit and EM), and development of a customized BST capacitor network built to meet your needs. Contact us for more information.